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Building a robust HBM2 PHY
What is HBM? HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it combines 2.5D packaging with a wider interface at a lower clock...
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The challenge of securing connected vehicles
Jeff Dorsch of Semiconductor Engineering recently noted that connected cars and the Internet of Things (IoT) go hand in hand. Nevertheless, says Dorsch, realizing the future of autonomous vehicles will...
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Protecting local government offices from ransomware
Last week, cyber criminals targeted computer systems operated by the government of Licking County, Ohio with a virus and an accompanying financial demand that has been labelled ransomware. Ransomware...
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Paul Kocher to moderate Cryptographers’ Panel at RSA 2017
Paul Kocher, the President and Chief Scientist of Rambus’ Cryptography Research division, will be moderating the RSA 2017 Cryptographers’ Panel on February 14th at 9:20AM. Participants, including Adi...
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Rambus and FASTR accelerate automotive security
Rambus has joined the Future of Automotive Security Technology Research (FASTR) consortium. Formerly known as the “Automotive Security Review Board,” FASTR was founded by Aeris, Intel Security and Uber...
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The Rambus HBM Gen2 PHY: A closer look
Earlier this week, Rambus announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built...
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Rambus launches High Bandwidth Memory PHY on GLOBALFOUNDRIES 14nm LPP
Rambus has announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for the GLOBALFOUNDRIES FX-14TM ASIC Platform. Designed for systems that require low latency and high...
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The Rambus 56 Gbps multi-protocol SerDes PHY: A closer look
Last week, we announced the launch of our 56G Multi-protocol SerDes (MPS) PHY developed on second-gen FinFET (Fin Field Effect Transistor) process technology. With a scalable ADC-based...
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Rambus announces 56G SerDes PHY on second-gen FinFET process technology
Rambus has announced a 56G Multi-protocol SerDes (MPS) PHY developed on second-gen FinFET (Fin Field Effect Transistor) process technology to meet the evolving demands of communications and data center...
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SPT pilots Rambus Ecebs HCE ticketing
The Strathclyde Partnership for Transport (SPT) is set to initiate a pilot program for the HCE ticketing solution recently launched by Rambus Ecebs. The HCE mobile ticketing suite, which securely loads...
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Android Wear 2.0 supports HCE mobile payments
Last week, Google released the fifth and final developer preview for Android Wear 2.0. The dev preview includes a number of bug fixes and enhancements, along with support for NFC host card emulation...
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Are we going cashless?
André Pfohlmann, an associate for the Banking Industry Business Unit at SAP, recently wrote an article in DigitalistMag that explores the recent trend amongst millennials and certain countries towards...
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Rambus is at DesignCon 2017
The DesignCon 2017 expo kicks off on February 2nd in Santa Clara. We’re at booth #833, showcasing our comprehensive suite of Ethernet, PCIe and DDRn IP solutions to solve today’s most challenging data...
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Why HCE is a “game changer” for smart ticketing
Richard Moore, a Product Manager at Rambus Ecebs, recently spoke with Transport Ticketing Global staff about host card emulation (HCE) and why the software-based architecture is a “game changer” for...
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Rambus Ecebs launches HCE mobile ticketing solution
Rambus Ecebs has launched a host card emulation (HCE) mobile ticketing solution that enables transport operators to replace physical smart cards with secure digital travel wallets housed on passenger...
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Smart travel goes mobile with HCE
The increased adoption of frictionless commerce by public transport operators is a critical prerequisite for the evolution of smart cities. This is precisely why transport operators have steadily...
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The wearables-mobile payment connection
Kirsty Tull, director of marketing and communications, BillPro.com, has written an article for MobilePaymentsToday about the positive role wearables could potentially play in the mobile payments...
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The need to simplify tokenization for mobile payments
André Stoorvogel, head of marketing at Rambus Bell ID, describes the increasing challenges associated with managing tokenization activity. As Stoorvogel notes in a blog post, banks around the world are...
View ArticleHappy 25th birthday, HAL!
Rambus Fellow Dr. David G. Stork recently penned an article for Semiconductor Engineering to mark the 25th birthday of HAL 9000, a (fictional) sentient computer which became operational on January 12,...
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Mobile proximity payments to hit $92 billion by 2019
With mobile proximity payments projected to reach $92 billion by 2019, merchants and card issuers are reportedly rushing to release branded mobile apps that capitalize on both in-store and online...
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